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Avoiding common #PCBdesign mistakes requires careful attention to the smallest details. Let's discuss the common mistakes and how to avoid them. ππ
1οΈβ£ Inadequate Trace Width: π
Different types of traces require different widths. Don't use the same width for power-carrying, high-impedance, and RF signal traces.
2οΈβ£ Via Sizing:π€
Determine the right drill diameter and annular ring to avoid manufacturing issues. A standard via size is 0.7mm diameter with a 0.3mm drill
3οΈβ£ Trace Spacing: π§
Don't just follow the minimum clearance allowed by the manufacturer, aim for a minimum of 3x the spacing between the signal layer and adjacent reference layer.
4οΈβ£ Decoupling: π
Proper decoupling is critical for a well-behaved system. Use decoupling capacitors, short and wide traces, and power vias to ensure proper power delivery.
5οΈβ£ Reference Planes: π
Use solid reference planes in designs, especially for AC signals. Avoid creating voids or splits in the reference plane and crossing them with a trace on the signal layer to prevent EMI problems.
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