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edited April 2023 in General Discussion

Avoiding common #PCBdesign mistakes requires careful attention to the smallest details. Let's discuss the common mistakes and how to avoid them. πŸ‘‹πŸ‘‹

1️⃣ Inadequate Trace Width: πŸ˜‰

Different types of traces require different widths. Don't use the same width for power-carrying, high-impedance, and RF signal traces.

2️⃣ Via Sizing:πŸ€“

Determine the right drill diameter and annular ring to avoid manufacturing issues. A standard via size is 0.7mm diameter with a 0.3mm drill

3️⃣ Trace Spacing: 🧐

Don't just follow the minimum clearance allowed by the manufacturer, aim for a minimum of 3x the spacing between the signal layer and adjacent reference layer.

4️⃣ Decoupling: 😊

Proper decoupling is critical for a well-behaved system. Use decoupling capacitors, short and wide traces, and power vias to ensure proper power delivery.

5️⃣ Reference Planes: πŸ˜ƒ

Use solid reference planes in designs, especially for AC signals. Avoid creating voids or splits in the reference plane and crossing them with a trace on the signal layer to prevent EMI problems.


...... and so on πŸ‘€πŸ‘€


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